US Patent No. 10,194,531

WIRING BOARD AND CONNECTION STRUCTURE


Patent No. 10,194,531
Issue Date January 29, 2019
Title Wiring Board And Connection Structure
Inventorship Shigemi Ohtsu, Kanagawa (JP)
Assignee FUJI XEROX CO., LTD., Minato-ku, Tokyo (JP)

Claim of US Patent No. 10,194,531

1. A wiring board comprising:a substrate comprising an insulation material; and
a plurality of conductive patterns including:
a plurality of electrodes arranged on a surface of the substrate along an end surface of the substrate; and
a plurality of wiring patterns connected to the plurality of electrodes, respectively,
wherein the substrate includes a notch formed between electrode groups,
wherein the notch is formed in an outermost peripheral side edge of the substrate,
wherein each of the electrode groups includes a predetermined number of the electrodes,
wherein the notch has a first width at the outermost peripheral side edge of the substrate, and
wherein the notch has a second width at a side opposite to the outermost peripheral side edge of the substrate, the second width being greater than the first width.