US Patent No. 10,194,530

MICROELECTRONIC SYSTEM INCLUDING PRINTED CIRCUIT BOARD HAVING IMPROVED POWER/GROUND BALL PAD ARRAY


Patent No. 10,194,530
Issue Date January 29, 2019
Title Microelectronic System Including Printed Circuit Board Having Improved Power/ground Ball Pad Array
Inventorship Sheng-Ming Chang, New Taipei (TW)
Chia-Hui Liu, Taichung (TW)
Shih-Chieh Lin, Taipei (TW)
Chun-Ping Chen, New Taipei (TW)
Assignee MEDIATEK INC., Hsin-Chu (TW)

Claim of US Patent No. 10,194,530

21. A microelectronic system, comprising:a base, comprising
an internal conductive layer;
a build-up layer on the internal conductive layer, said build-up layer comprising a top conductive layer;
a plurality of microvias in the build-up layer to electrically connect the top conductive layer with the internal conductive layer;
a power net in the top conductive layer, said power net comprising a plurality of power ball pads arranged in cascade; and
a ground net disposed being in close proximity to said power net and coupled to said power net in an interdigitated fashion, wherein said ground net comprises a plurality of ground ball pads arranged in cascade; and
a semiconductor device mounted on the base.