US Patent No. 10,194,522

THERMAL INTERFACE SOLUTION WITH REDUCED ADHESION FORCE


Patent No. 10,194,522
Issue Date January 29, 2019
Title Thermal Interface Solution With Reduced Adhesion Force
Inventorship Timothy J. Chainer, Armonk, NY (US)
Michael Gaynes, Armonk, NY (US)
Assignee International Business Machines Corporation, Armonk, NY (US)

Claim of US Patent No. 10,194,522

1. A method comprising applying an adhesive to a first substrate and a second substrate to secure said first substrate to said second substrate, said adhesive extending in a plane on one side of an interposer, said interposer also extending in said plane and contiguous with said adhesive, said interposer comprising openings to enable the flow of said adhesive through said openings to form adhesive bond areas on one of said substrates that substantially conform to said openings, said bond areas being adjacent to adhesive free areas, the other of said substrate being substantially covered by said adhesive, so that said adhesive bond areas produce regions of reduced adhesive strength to said one substrate compared to the strength of the bond of said adhesive to said other substrate, where one of said substrates comprises a VTM electronic device, and the other of said substrates comprises a heat spreader substrate.