US Patent No. 10,194,519

CHIP MOUNTER, ELECTRONIC CIRCUIT SUBSTRATE, AND POWER MODULE


Patent No. 10,194,519
Issue Date January 29, 2019
Title Chip Mounter, Electronic Circuit Substrate, And Power Module
Inventorship Tetsuya Ueda, Tokyo (JP)
Takahiko Anan, Hyogo (JP)
Assignee Mitsubishi Electric Corporation, Tokyo (JP)

Claim of US Patent No. 10,194,519

1. A chip mounter configured to take out a chip component accommodated in a packing tape and mount the chip component onto a substrate,the packing tape comprising
a carrier tape comprising a plurality of pockets individually accommodating a plurality of the chip components, and
a cover tape covering individual openings of the plurality of pockets,
the plurality of pockets each comprising a bottom surface comprising a through hole,
the chip mounter comprising:
a tape travelling rail on which the packing tape to be fed to a suction point travels;
a sucking-and-mounting arm configured to, at the suction point, take out the chip component from the pocket of the carrier tape with the cover tape detached therefrom by sucking the chip component; and
a cavity cleaning mechanism,
wherein the cavity cleaning mechanism comprises an intake hole disposed upstream of the suction point, in a location of the tape travelling rail, on which the carrier tape with the cover tape attached thereto travels so as to overlap the through hole, and
wherein the cavity cleaning mechanism is configured to take in an inside of the pocket through the intake hole and the through hole.