US Patent No. 10,189,706

METHOD FOR SELF-ALIGNING SOLDER-ATTACHED MEMS DIE TO A MOUNTING SURFACE


Patent No. 10,189,706
Issue Date January 29, 2019
Title Method For Self-aligning Solder-attached Mems Die To A Mounting Surface
Inventorship Wayne C. Long, Austin, TX (US)
Joe A. Ojeda, Austin, TX (US)
Gengxun K. Gurley, Hutto, TX (US)
Joseph L. Nguyen, Austin, TX (US)
Assignee DunAn Microstaq, Inc., Austin, TX (US)

Claim of US Patent No. 10,189,706

1. A method of attaching a MEMS die to a surface, the method comprising:placing solder mask having a centrally formed flow area on a solder surface of a body;
centering and rotationally aligning a solder perform on the solder surface of the body within the flow area of the solder mask;
centering and rotationally aligning a MEMS die on the solder preform; and
heating the solder perform in a reflow process until the solder is molten and surface tension of the molten solder moves the MEMS die to a position where the surface tensions balance and the MEMS die is centered within the flow area of the solder mask;
wherein the solder surface of the body is substantially circular and the solder preform is substantially rectangular.