1. A method of attaching a MEMS die to a surface, the method comprising:placing solder mask having a centrally formed flow area on a solder surface of a body;
centering and rotationally aligning a solder perform on the solder surface of the body within the flow area of the solder mask;
centering and rotationally aligning a MEMS die on the solder preform; and
heating the solder perform in a reflow process until the solder is molten and surface tension of the molten solder moves the MEMS die to a position where the surface tensions balance and the MEMS die is centered within the flow area of the solder mask;
wherein the solder surface of the body is substantially circular and the solder preform is substantially rectangular.