US Patent No. 10,187,984

CIRCUIT BOARD AND METHOD FOR MAKING THE SAME


Patent No. 10,187,984
Issue Date January 22, 2019
Title Circuit Board And Method For Making The Same
Inventorship Ning Hou, Shenzhen (CN)
Si-Hong He, Shenzhen (CN)
Biao Li, Shenzhen (CN)
Mei-Hua Huang, Shenzhen (CN)
Assignee Avary Holding (Shenzhen) Co., Limited., Shenzhen (CN) HongQiSheng Precisio...

Claim of US Patent No. 10,187,984

1. A circuit board comprising: a substrate; at least one conductive circuit layer attached to the substrate; at least one plating film attached to a surface of each of the at least one conductive circuit layer away from the substrate, each of the at least one plating film comprises a surface away from each of the at least one conductive circuit layer, and at least one side surface connecting each of the at least one conductive circuit layer and the surface away from each of the at least one conductive circuit layer; and a covering film; wherein the circuit board defines at least one through hole, each of the at least one through hole passes through the substrate, the at least one conductive circuit layer, and each of the at least one plating film, the covering film covers an exposing surface of each of the at least one conductive circuit layer, the at least one side surface of each of the at least one plating film, and a side wall of each of the at least one through hole, wherein a portion of the surface of the substrate attached to each of the at least one conductive circuit layer is exposed through each of the at least one conductive circuit layer, the exposed portion of the surface of the substrate attached to each of the at least one conductive circuit layer is covered by the covering film.