US Patent No. 10,172,268

ELECTRONIC COMPONENT MOUNTING DEVICE


Patent No. 10,172,268
Issue Date January 01, 2019
Title Electronic Component Mounting Device
Inventorship Seiji Ohnishi, Kumagaya (JP)
Koichi Izuhara, Iwata (JP)
Hiroyuki Watanabe, Kumagaya (JP)
Takashi Yoshii, Kumagaya (JP)
Assignee YAMAHA HATSUDOKI KABUSHIKI KAISHA, Shizuoka-ken (JP)

Claim of US Patent No. 10,172,268

1. A component mounting device comprising:a mounting head that is movable in a horizontal direction and mounts a held component on a substrate; and
a control portion that controls operation of the mounting head,
the control portion being configured to perform control of making a speed of mounting, by the mounting head, of a component to be located closely adjacent to another component and to be mounted on the substrate such that an interval to an adjacent component is equal to or less than a predetermined threshold, on the substrate, less than a speed of mounting in a normal state in which the mounting head mounts a component, which is not the component to be located closely adjacent to another component, on the substrate,
wherein
the mounting head includes a plurality of suction nozzles movable in a vertical direction, and
the control portion is configured to perform control of releasing a state in which a speed of mounting operation performed by the suction nozzles is reduced, on the basis of completion of mounting of the component to be located closely adjacent to another component, in a state in which the plurality of suction nozzles suction the component to be located closely adjacent to another component and the component, which is not the component to be located closely adjacent to another component, in a mixed manner.