US Patent No. 10,172,264


Patent No. 10,172,264
Issue Date January 01, 2019
Title Housing And Electronic Device
Inventorship Yoshiaki Hiratsuka, Ota (JP)
Kai Nojima, Yokohama (JP)
Kenji Nagase, Yokohama (JP)
Yoshinori Mesaki, Yokohama (JP)
Assignee FUJITSU LIMITED, Kawasaki (JP)

Claim of US Patent No. 10,172,264

1. A housing comprising:a first member that has a first conductor;
a second member that has a second conductor and cooperates with the first member to accommodate a circuit board on which an electronic element is mounted, inside a space surrounded by the first conductor and the second conductor; and
a plurality of connecting elements that are arranged at a predetermined arrangement interval y to fix the second member to the first member,
wherein, when an overlapping width between the first conductor and the second conductor is x, a frequency of a clock signal flowing through the circuit board is f, a speed of light is c, and a wavelength of electromagnetic noise is ?=c/f, a value of the arrangement interval y is calculated by following equation (1) or (2),
when x?2.2 mm, y?(0.13x+0.0015)?  (1)
when x>2.2 mm, y=(10?5x3?0.0006x2+0.012x+0.25)?  (2).