1. An electronic assembly comprising:a printed circuit having a ground conductor and a plurality of thru-holes, the thru-holes exposing conductive material that is in communication with the ground conductor, the printed circuit having a substrate surface;
a conductive shield having a plurality of sidewalls, the sidewalls defining a cavity that is sized and shaped to receive an electronic component therein, wherein edges of at least some of the sidewalls interface with the printed circuit along a perimeter line, the perimeter line extending along the substrate surface and intersecting the thru-holes or extending immediately adjacent to the thru-holes;
a plurality of grounding contacts that are each discrete with respect to the conductive shield, wherein each of the grounding contacts of said plurality comprises a pin segment and a wall-engaging segment;
wherein the pin segments include compliant pins that are insertable into the thru-holes and the wall-engaging segments are connected to respective sidewalls, the grounding contacts being distributed along the perimeter line and electrically coupling the conductive shield to the ground conductor of the printed circuit, wherein the edges of the at least some sidewalls engage the substrate surface along the perimeter line as the edges extend between adjacent grounding contacts.