US Patent No. 10,172,258

COOLING STRUCTURE FOR ELECTRONIC BOARDS


Patent No. 10,172,258
Issue Date January 01, 2019
Title Cooling Structure For Electronic Boards
Inventorship Paul F. Bodenweber, Kingston, NY (US)
Kenneth C. Marston, Poughquag, NY (US)
Kamal K. Sikka, Poughkeepsie, NY (US)
Hilton T. Toy, Hopewell Junction, NY (US)
Randall J. Werner, Pougkeepsie, NY (US)
Jeffrey A. Zitz, Poughkeepsie, NY (US)
Assignee INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US)

Claim of US Patent No. 10,172,258

1. A manifold assembly, comprising:a frame assembly having a plurality of sealed compartments each comprising a single heat sink registered to an underlying chip and/or package mounted on an electronic board;
a fluid channel within the frame assembly; and
an inlet and an outlet associated with each of the sealed compartments and in fluid communication with the fluid channel, the inlet and the outlet directing coolant over the single heat sink of each of the sealed compartments,
wherein the frame assembly includes:
a plurality of openings in a frame; and
a cold plate assembly sealed to sidewalls of the openings of a bottom plate,
fluid channels in the cold plate which includes the inlet and outlet for each of the sealed compartments, and
wherein the heat sink is mounted within each of the plurality of openings of the frame and in combination with sidewalls of the openings of the frame and the cold plate assembly form individual compartments each of which is in fluid communication with the fluid channels.