US Patent No. 10,172,249

INTERPOSER ELECTRICAL CONNECTOR FOR A CHIP MODULE


Patent No. 10,172,249
Issue Date January 01, 2019
Title Interposer Electrical Connector For A Chip Module
Inventorship Ted Ju, Keelung (TW)
Zuo Feng Jin, Keelung (TW)
Assignee LOTES CO., LTD, Keelung (TW)

Claim of US Patent No. 10,172,249

1. An electrical connector for electrically connecting a chip module, comprising:an insulating body, provided with a plurality of accommodating grooves in multiple rows and vertically passing through the insulating body, wherein:
each two adjacent ones of the accommodating grooves are provided with a partition or a space above the partition;
the insulating body is concavely provided downward with at least one groove correspondingly located on the partitions or in the space above the partition, the groove has a bottom surface and a side surface being closed and formed by extending upward from a periphery of the bottom surface, and the groove is configured for a pushing pin to push and eject the insulating body from a mold; and
the insulating body is protrudingly provided upward with a plurality of protruding blocks, configured to support the chip module, wherein the at least one groove and all of the protruding blocks spaced apart from the groove are not located on a same one of the partitions; and
a plurality of terminals, correspondingly accommodated in the accommodating grooves and configured to conductively connected with the chip module.