US Patent No. 10,172,247

HOUSING WITH ELECTRONIC COMPONENTS


Patent No. 10,172,247
Issue Date January 01, 2019
Title Housing With Electronic Components
Inventorship Mario Lenz, Kerpen (DE)
Stephan Werker, Merzenich (DE)
Eric Rooks, Bonn (DE)
Assignee HANON SYSTEMS, Daejeon (KR)

Claim of US Patent No. 10,172,247

1. An enclosure for electronic components, the enclosure comprising:a base;
a capping engaging the base, the base and the capping forming a room for receiving at least one circuit board;
at least one circuit board support positioned on the base supporting the at least one circuit board; and
at least one fastening element attaching the at least one circuit board to the at least one circuit board support through an engagement with the at least one circuit board support, the at least one fastening element including an internal portion disposed within an opening of the at least one circuit board support and an external end disposed outside of the opening of the at least one circuit board support, wherein a space is present between the external end of the at least one fastening element and the capping, wherein a distance between the external end of the at least one fastening element and the capping as measured across the space in an axial direction of the at least one fastening element is smaller than a length of the internal portion of the at least one fastening element disposed within the opening of the at least one circuit board support in a manner wherein a detachment of the at least one fastening element from the at least one circuit board support is prevented.