US Patent No. 10,172,243


Patent No. 10,172,243
Issue Date January 01, 2019
Title Printed Circuit Board And Methods To Enhance Reliability
Inventorship Bruce J. Chamberlin, Vestal, NY (US)
Scott B. King, Rochester, NY (US)
Joseph Kuczynski, North Port, FL (US)
David J. Russell, Owego, NY (US)
Assignee International Business Machines Corporation, Armonk, NY (US)

Claim of US Patent No. 10,172,243

1. A method, comprising:forming a plurality of through holes in a substrate, the substrate comprising a plurality of metal layers separated by a plurality of insulating layers;
selectively etching the insulating layers in the through holes to form a plurality of copper lands and recesses between the copper lands;
exposing the substrate to a polymerization precursor mixture comprising an initiator and a monomer or oligomer whose polymerization is inhibited by copper to form a precursor layer in the recesses of the through holes;
polymerizing the precursor layer to form a polymer coating in the recesses of the through holes; and
washing the through holes with an organic solvent.