US Patent No. 10,172,241

METHOD FOR PACKAGING FLEXIBLE DEVICE USING HOLDING WAFER, AND FLEXIBLE DEVICE MANUFACTURED BY THE SAME


Patent No. 10,172,241
Issue Date January 01, 2019
Title Method For Packaging Flexible Device Using Holding Wafer, And Flexible Device Manufactured By The Same
Inventorship Kyung Wook Baek, Daejeon (KR)
Keon Jae Lee, Daejeon (KR)
Geon Tae Hwang, Daejeon (KR)
Hyeon Kyun Yoo, Daejeon (KR)
Do Hyun Kim, Daejeon (KR)
Yoo Sun Kim, Daejeon (KR)
Assignee Korea Advanced Institute of Science and Technology, Daejeon (KR)

Claim of US Patent No. 10,172,241

1. A method for manufacturing a flexible device, comprising:preparing an electronic device on an upper portion of a circuit board;
forming a bump on the electronic device such that the bump is attached to a top surface of the electronic device and protrudes upward from the electronic device;
bringing a fixed substrate into contact with an upper portion of the electronic device to fix the circuit board; then
reducing a thickness of the circuit board: then
bringing a support substrate formed of silicon or glass into contact with a lower portion of the circuit board; then
removing the fixed substrate; and then
laminating an anisotropic conductive film toward an upper portion of the electronic device and heating and pressing a flexible substrate having an electrode line thereto, such that the anisotropic conductive film covers and comes in direct contact with the top surface of the electronic device, a side surface of the bump and an entire top surface of the bump, and then
forming a passivation layer which comes in contact with the flexible substrate and coats a side surface of the anisotropic conductive film, a side surface of the circuit board and both of a side surface and a bottom surface of the support substrate formed of silicon or glass,
wherein the flexible substrate is disposed on the upper portion of the circuit board, while the support substrate formed of silicon or glass is maintained in contact with the lower portion of the circuit board,
wherein the electrode line of the flexible substrate is configured to contact the anisotropic conductive film and then extend to an outer side of the anisotropic conductive film.