US Patent No. 10,172,240

WIRE BONDED ELECTRONIC DEVICES TO ROUND WIRE


Patent No. 10,172,240
Issue Date January 01, 2019
Title Wire Bonded Electronic Devices To Round Wire
Inventorship Robert Neuman, Cannon Falls, MN (US)
Assignee Automated Assembly Corporation, Lakeville, MN (US)

Claim of US Patent No. 10,172,240

9. A method of making a circuit arrangement, comprising:picking and placing first and second metal foil pads on a flexible substrate;
attaching the first and second metal foil pads to the flexible substrate by a first layer of pressure-sensitive adhesive (PSA) on the flexible substrate;
attaching an electronic device to the flexible substrate by the first layer of PSA proximate the first and second metal foil pads;
attaching one or more wire segments of electrically conductive wire to the flexible substrate by the first layer of PSA, the one or more wire segments having a round cross section and first and second portions disposed over the first and second metal foil pads, respectively;
welding the first and second portions of the one or more wire segments to the first and second metal foil pads, respectively; and
wire bonding the electronic device to the first and second metal foil pads making first and second wire bond joints between first and second bond wires and the first and second metal foil pads, respectively.