US Patent No. 10,172,239

TAMPER-RESPONDENT SENSORS WITH FORMED FLEXIBLE LAYER(S)


Patent No. 10,172,239
Issue Date January 01, 2019
Title Tamper-respondent Sensors With Formed Flexible Layer(s)
Inventorship John R. Dangler, Rochester, MN (US)
Phillip Duane Isaacs, Rochester, MN (US)
David C. Long, Wappingers Fall, NY (US)
Assignee INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US)

Claim of US Patent No. 10,172,239

1. A tamper-respondent assembly comprising:a tamper-respondent sensor, the tamper-respondent sensor comprising:
at least one formed flexible layer having opposite first and second sides with surface curvatures extending from the opposite first and second sides of the at least one formed flexible layer: and
circuit lines forming at least one resistive network, the circuit lines being disposed on at least one of the first side or the second side of the at least one formed flexible layer, the circuit lines wrapping over, at least in part, the surface curvatures extending from the at least one first side or second side of the at least one formed flexible layer,
wherein the at least one formed flexible layer is collapsed as a flattened, folded layer.