US Patent No. 10,172,234

WIRED CIRCUIT BOARD


Patent No. 10,172,234
Issue Date January 01, 2019
Title Wired Circuit Board
Inventorship Yuu Sugimoto, Osaka (JP)
Hiroyuki Tanabe, Osaka (JP)
Assignee NITTO DENKO CORPORATION, Osaka (JP)

Claim of US Patent No. 10,172,234

1. A wired circuit board comprising:a first insulating layer;
a first conductive pattern provided on the first insulating layer;
a second insulating layer provided on the first insulating layer and covering the first conductive pattern; and
a second conductive pattern provided on a top face in a thickness direction of the second insulating layer,
wherein the top face of the second insulating layer includes an inclined face and a flat face,
wherein the inclined face swells from the flat face so as to correspond to a ridgeline of the first conductive pattern,
wherein the second conductive pattern is provided on the flat face and is offset from the first conductive pattern and the inclined face when projected in the thickness direction of the second insulating layer,
wherein an interval between the second conductive pattern and the first conductive pattern is in a range of 1 ?m to 300 ?m when viewed in a plan view,
wherein the inclined face and the flat face form an angle therebetween, and form a supplementary angle y to the angle formed by the inclined face and the flat face, and
wherein the supplementary angle y to the angle formed by the inclined face and the flat face is more than 0 degree and 20 degrees or less.