US Patent No. 10,172,229

SYSTEMS AND METHODS FOR COMBINED THERMAL AND ELECTRICAL ENERGY TRANSFER


Patent No. 10,172,229
Issue Date January 01, 2019
Title Systems And Methods For Combined Thermal And Electrical Energy Transfer
Inventorship Kevin Michael Coakley, Belmont, CA (US)
Malcolm Brown, Mountain View, CA (US)
Assignee CelLink Corporation, San Carlos, CA (US)

Claim of US Patent No. 10,172,229

1. An interconnect circuit comprising:an electro-thermal conductor, comprising a thermal conductor portion and a first electrical conductor portion,
wherein the thermal conductor portion is electrically isolated from the first electrical conductor portion by a gap defining a boundary of the first electrical conductor portion,
wherein each of the thermal conductor portion and the first electrical conductor portion comprises a base sublayer and a surface sublayer having a different composition than the base sublayer, and
wherein the thermal conductor portion and the first electrical conductor portion have an identical thickness;
a first insulator, adhered to the surface sublayer of the thermal conductor portion and to the surface sublayer of the first electrical conductor portion, wherein the first insulator supports the thermal conductor portion and the first electrical conductor portion relative to each other thereby maintaining electrical isolation between the thermal conductor portion and the first electrical conductor portion; and
a heat sink, thermally coupled to at least the electro-thermal conductor by an adhesive.