1. An LED emitter comprising:a substrate having:
a body with a recess region formed therein;
a plurality of bonding pads disposed within the recess region, the plurality of bonding pads including a plurality of LED bonding pads and a plurality of supporting chip bonding pads;
an external power contact disposed outside the recess region;
a plurality of electrical paths disposed at least partially within the body of the substrate, the electrical paths connecting the external power contact to at least one of the supporting chip bonding pads and connecting a first subset of the supporting chip bonding pads to the plurality of LED bonding pads such that a supporting chip connected to the supporting chip bonding pads is operable to deliver different operating currents to different ones of the LEDs;
a plurality of LEDs disposed in the recess region and connected to the LED bonding pads;
a supporting chip disposed in the recess region and connected to the supporting chip bonding pads, the supporting chip including a driver circuit to generate different operating currents for the different ones of the LEDs, a control circuit to control operation of the driver circuit in response to an external control signal, and a programmable read-only memory to store a mapping between each of a plurality of states of the external control signal and a corresponding distribution of operating currents to be generated by the driver circuit; and
an optically transparent cover disposed over and sealed to the recess region.