1. A semiconductor structure, comprising:a substrate;
a chip disposed over the substrate; and
a molding disposed over the substrate and surrounding the chip at a molding temperature,
wherein the substrate includes a curved configuration at a side opposite to the chip, and the molding includes a reduced size which compensates a warpage of the curved configuration of the substrate at the molding temperature, so that the warpage of the substrate is convex or about zero at the molding temperature or 10° C. more or less than the molding temperature.