US Patent No. 10,170,340

SEMICONDUCTOR STRUCTURE


Patent No. 10,170,340
Issue Date January 01, 2019
Title Semiconductor Structure
Inventorship Po Chun Lin, Changhua (TW)
Assignee NANYA TECHNOLOGY CORPORATION, Taoyuan (TW)

Claim of US Patent No. 10,170,340

1. A semiconductor structure, comprising:a substrate;
a chip disposed over the substrate; and
a molding disposed over the substrate and surrounding the chip at a molding temperature,
wherein the substrate includes a curved configuration at a side opposite to the chip, and the molding includes a reduced size which compensates a warpage of the curved configuration of the substrate at the molding temperature, so that the warpage of the substrate is convex or about zero at the molding temperature or 10° C. more or less than the molding temperature.