US Patent No. 10,170,339

SEMICONDUCTOR STRUCTURE AND A MANUFACTURING METHOD THEREOF


Patent No. 10,170,339
Issue Date January 01, 2019
Title Semiconductor Structure And A Manufacturing Method Thereof
Inventorship Po Chun Lin, Changhua (TW)
Assignee NANYA TECHNOLOGY CORPORATION, Taoyuan (TW)

Claim of US Patent No. 10,170,339

1. A method of manufacturing a semiconductor structure, comprising:providing a substrate and a chip disposed over the substrate;
disposing the substrate over a first molding member;
disposing a second molding member over the substrate to encapsulate the chip;
disposing a molding material around the chip;
forming a molding over the substrate and around the chip;
removing the first molding member;
removing the second molding member,
wherein the first molding member includes a curved surface protruded towards the substrate, the chip or the second molding member,
wherein the substrate or the chip is curved to match a curvature of the curved surface of the first molding member before disposing the molding material, and
wherein the substrate and the chip are entirely encapsulated by the first molding member and the second molding member before disposing the molding material.