US Patent No. 10,169,714

MODULAR ARRAY OF VERTICALLY INTEGRATED SUPERCONDUCTING QUBIT DEVICES FOR SCALABLE QUANTUM COMPUTING


Patent No. 10,169,714
Issue Date January 01, 2019
Title Modular Array Of Vertically Integrated Superconducting Qubit Devices For Scalable Quantum Computing
Inventorship Jerry M. Chow, White Plains, NY (US)
Jay M. Gambetta, Yorktown Heights, NY (US)
Mary B. Rothwell, Ridgefield, CT (US)
James R. Rozen, Peekskill, NY (US)
Assignee INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US)

Claim of US Patent No. 10,169,714

1. A quantum device comprising:a first substrate including a first set of locations;
a second substrate including a second set of locations; and
qubit chips having a first end positioned at the first set of locations and having a second end positioned at the second set of locations, wherein at least one of the qubit chips is configured to be removable.