1. A light emitting diode (LED) module comprising:a first dielectric layer on a base metal substrate;
a first patterned metal layer on the first dielectric layer;
a local shielding area within the first patterned metal layer, the local shielding area comprising a substantially continuous area of conductive material;
a second dielectric layer on the first patterned metal layer;
a second patterned metal layer on the second dielectric layer;
one or more LEDs on the second patterned metal layer, wherein the one or more LEDs are thermally coupled to the base metal substrate;
one or more devices on the second patterned metal layer configured to provide a target current to the one or more LEDs, wherein a device of the one or more devices carries a steep slope voltage waveform and is located above at least a portion of the local shielding area; and
a DC voltage node on the second patterned metal layer, wherein the DC voltage node is electrically connected to the local shielding area.