US Patent No. 10,143,110

MIDDLE FRAME MEMBER AND METHOD FOR MANUFACTURING MIDDLE FRAME MEMBER


Patent No. 10,143,110
Issue Date November 27, 2018
Title Middle Frame Member And Method For Manufacturing Middle Frame Member
Inventorship Ming Cai, Shenzhen (CN)
Banghong Hu, Shenzhen (CN)
Longyu Li, Shenzhen (CN)
Assignee HUAWEI TECHNOLOGIES CO., LTD., Shenzhen, Guangdong (CN)

Claim of US Patent No. 10,143,110

1. A middle frame member, comprising:a middle frame substrate body, wherein the middle frame member is a support part inside an electronic product for supporting components in the electronic product;
a first metal layer, attached to a first area of the middle frame substrate body, wherein a coefficient of heat conductivity of the first metal layer is greater than a coefficient of heat conductivity of the middle frame substrate body, the first area comprises all or a part of an outer surface of the middle frame substrate body, and the first metal layer is used to conduct, to the middle frame substrate body, heat generated by at least one of the components that is in contact with or adjacent to the first metal layer;
a second metal layer, attached to the second area on the surface of the middle frame substrate body, wherein an electrode potential difference between the second metal layer and the metal antenna spring plate is less than an electrode potential difference between the middle frame substrate body and the metal antenna spring plate; and
a passivated insulation layer, attached to a surface of the first metal layer.