US Patent No. 10,143,105

RE-USABLE MODULAR SKID ASSEMBLY FOR SHIPPING ELECTRONIC MODULES


Patent No. 10,143,105
Issue Date November 27, 2018
Title Re-usable Modular Skid Assembly For Shipping Electronic Modules
Inventorship William Ziegler, Reading, MA (US)
Louis Perry, Acton, MA (US)
Assignee SCHNEIDER ELECTRIC IT CORPORATION, West Kingston, RI (US)

Claim of US Patent No. 10,143,105

1. A modular skid assembly configured to transport at least one modular electrical component, the modular skid assembly comprising:a plate including an upper surface configured to support the at least one modular electrical component;
a first side beam extending longitudinally along one side of the plate, the first side beam being secured to the plate;
a second side beam extending longitudinally along an opposite side of the plate, the second side beam being secured to the plate;
a plurality of joists extending laterally beneath the plate, the plurality of joists extending between the first side beam and the second side beam;
a first shipping beam configured to be releasably secured to the first side beam; and
a second shipping beam configured to be releasably secured to the second side beam;
wherein a lower flange of the first shipping beam extends laterally in an opposite direction to a lower flange of the first side beam, and a lower flange of the second shipping beam extends laterally in an opposite direction to a lower flange of the second side beam.