1. A method for gripping a semiconductor module, comprising the steps:providing a semiconductor module, the semiconductor module comprising:
an outer housing having four side walls;
a circuit carrier, which is mounted on the outer housing and has an upper side and a lower side opposite the upper side;
a semiconductor chip, which is arranged on the upper side and in the outer housing; and
a first gripping socket, which is formed as an indentation and extends from the outer side of the outer housing into a first of the side walls;
providing a positioning device, which has a first gripping finger; and
gripping the semiconductor module by means of the positioning device, the first gripping finger engaging in the first gripping socket,
moving the semiconductor module by means of the positioning device after the gripping, wherein the semiconductor module is turned upside down by the positioning device during the moving of the semiconductor module.