US Patent No. 10,143,087

CAPACITOR ELEMENT-MOUNTED STRUCTURE


Patent No. 10,143,087
Issue Date November 27, 2018
Title Capacitor Element-mounted Structure
Inventorship Kazuo Hattori, Nagaokakyo (JP)
Isamu Fujimoto, Nagaokakyo (JP)
Assignee MURATA MANUFACTURING CO., LTD., Kyoto (JP)

Claim of US Patent No. 10,143,087

1. A capacitor element-mounted structure comprising:a first capacitor element and a second capacitor element each including a dielectric layer and an internal electrode layer alternately stacked along a stacking direction;
a wiring board including a main surface with the first capacitor element and the second capacitor element mounted thereon; and
a mold resin layer encapsulating the first capacitor element and the second capacitor element; wherein
the first capacitor element and the second capacitor element are electrically connected in series or in parallel through a conductive pattern provided on the wiring board;
the first capacitor element and the second capacitor element each include a surface opposed to the wiring board including short sides and long sides;
each of the first capacitor element and the second capacitor element includes a pair of end surfaces facing each other in a direction in which the long sides extend, a pair of side surfaces facing each other in a direction in which the short sides extend, and a pair of external electrodes spaced apart from each other on an outer surface of the multilayer structure;
each of the external electrodes included in the first capacitor element and the second capacitor element is bonded to a land through a conductive bonding member, the land being provided on the wiring board so as to correspond to a position of each of the external electrodes;
one of the pair of end surfaces of the first capacitor element is opposed to one of the pair of side surfaces of the second capacitor element with the mold resin layer interposed; and
both of the stacking direction in the first capacitor element and the stacking direction in the second capacitor element are oriented in a direction along the main surface of the wiring board.