US Patent No. 10,143,085

MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME


Patent No. 10,143,085
Issue Date November 27, 2018
Title Multilayer Electronic Component And Board Having The Same
Inventorship Heung Kil Park, Suwon-si (KR)
Jong Hwan Park, Suwon-si (KR)
Young Ghyu Ahn, Suwon-si (KR)
Assignee SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-do (KR)

Claim of US Patent No. 10,143,085

1. A multilayer electronic component comprising:a first multilayer capacitor electrically connected to a first surface of a support plate formed of an insulating material; and
first and second metal frames electrically connected to first and second ends of the support plate, respectively;
wherein the first and second metal frames extend in an amount greater than a thickness of the first multilayer capacitor so that a first end of the first and second metal frames constitutes a mounting part,
wherein the mounting part is disposed on an opposite side of the first multilayer capacitor relative to the support plate,
wherein the first and second metal frames have first and second coupling grooves formed on upper portions of the first and second metal frames such that the first and second ends of the support plate are coupled to the first and second coupling grooves, respectively,
wherein the first multilayer capacitor is electrically connected to the first and second metal frames via the first and second ends of the support plate, respectively, and
wherein the first multilayer capacitor is spaced apart from the first and second metal frames.