US Patent No. 10,143,084

PLATED OPENING WITH VENT PATH


Patent No. 10,143,084
Issue Date November 27, 2018
Title Plated Opening With Vent Path
Inventorship Michael B. Vincent, Austin, TX (US)
Zhiwei Gong, Austin, TX (US)
Scott M. Hayes, Austin, TX (US)
Assignee NXP USA, INC., Austin, TX (US)

Claim of US Patent No. 10,143,084

1. A method of forming a plated opening in a workpiece comprising:forming a first opening in a first major surface of workpiece, wherein the forming the first opening includes removing non-conductive material of the workpiece to form a sidewall of the non-conductive material;
plating the sidewall with a conductive material to form a sidewall plating;
after the plating, forming a vent opening, wherein the forming the vent opening includes removing a portion of the non-conductive material at the sidewall, wherein at least a first portion of the sidewall plating remains after the forming the vent opening, wherein the forming the vent opening includes forming a second sidewall of the non-conductive material that is not covered by the sidewall plating.