US Patent No. 10,143,083
SUBSTRATE FOR PRINTED CIRCUIT BOARD AND METHOD FOR PRODUCING SUBSTRATE FOR PRINTED CIRCUIT BOARD
| Patent No. | 10,143,083 |
|---|---|
| Issue Date | November 27, 2018 |
| Title | Substrate For Printed Circuit Board And Method For Producing Substrate For Printed Circuit Board |
| Inventorship | Motohiko Sugiura, Osaka (JP) Takashi Kasuga, Osaka (JP) Yoshio Oka, Osaka (JP) Shigeaki Uemura, Osaka (JP) Jinjoo Park, Koka (JP) Hiroshi Ueda, Koka (JP) Kousuke Miura, Koka (JP) |
| Assignee | SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka-shi, Osaka (JP) SUMITOMO ELECTRI... |
Claim of US Patent No. 10,143,083
1. A substrate for a printed circuit board, comprising:a base film having an insulating property; and
a metal layer formed on at least one surface side of the base film,
wherein a plurality of fine particles are disposed between the base film and the metal layer so as to adhere to both the base film and the metal layer, and
the fine particles are formed of a metal the same as a main metal of the metal layer or formed of a metal compound of the main metal,
wherein the fine particles are formed of a metal oxide or a metal hydroxide, and have an average particle size of 0.1 nm or more and 20 nm or less.
a metal layer formed on at least one surface side of the base film,
wherein a plurality of fine particles are disposed between the base film and the metal layer so as to adhere to both the base film and the metal layer, and
the fine particles are formed of a metal the same as a main metal of the metal layer or formed of a metal compound of the main metal,
wherein the fine particles are formed of a metal oxide or a metal hydroxide, and have an average particle size of 0.1 nm or more and 20 nm or less.