US Patent No. 10,134,964

PASSIVATION FOR A SEMICONDUCTOR LIGHT EMITTING DEVICE


Patent No. 10,134,964
Issue Date November 20, 2018
Title Passivation For A Semiconductor Light Emitting Device
Inventorship Frederic S. Diana, Santa Clara, CA (US)
Henry Kwong-Hin Choy, Sunnyvale, CA (US)
Qingwei Mo, Sunnyvale, CA (US)
Serge L. Rudaz, Sunnyvale, CA (US)
Frank L. Wei, San Francisco, CA (US)
Daniel A. Steigerwald, Cupertino, CA (US)
Assignee LUMILEDS LLC, San Jose, CA (US)

Claim of US Patent No. 10,134,964

1. A method, comprising:providing a wafer comprising a plurality of semiconductor light emitting devices, each light emitting device comprising an active region disposed between an n-type region and a p-type region, and a metal bonding layer coupled to an exposed portion of the n-type region;
disposing a first material comprising a dielectric layer on the wafer, including disposing a portion of the dielectric layer directly on a first area of the exposed portion of the n-type region that is located between two semiconductor light emitting devices;
disposing a second material comprising an underfill in areas between the wafer and a mount, including disposing the underfill directly on (1) the portion of the dielectric layer and (2) a second area of the exposed portion of the n-type layer, the portion of the dielectric layer improving adhesion of the underfill to the exposed portion of the n-type layer; and
attaching the wafer to the mount.