US Patent No. 10,117,357

STATIONARY COOLING STRUCTURE FOR BOARD/CHASSIS-LEVEL CONDUCTION COOLING


Patent No. 10,117,357
Issue Date October 30, 2018
Title Stationary Cooling Structure For Board/chassis-level Conduction Cooling
Inventorship Mo Bai, San Jose, CA (US)
Vadim Gektin, San Jose, CA (US)
Assignee FUTUREWEI TECHNOLOGIES, INC., Plano, TX (US)

Claim of US Patent No. 10,117,357

1. An enclosure for housing one or more printed circuit board assemblies inserted in an insertion direction into one or more bays of the enclosure, the enclosure comprising:a cold plate, fixedly attached to a surface of a bay of the one or more bays, the cold plate comprising a first surface for conducting heat, the first surface of the cold plate provided at an oblique angle with respect to the insertion direction; and
a vapor chamber formed in a printed circuit board assembly of the one or more printed circuit board assemblies, the vapor chamber comprising a first surface for conducting heat, the first surface of the vapor chamber provided at an angle complementary to the oblique angle of the first surface of the cold plate, the first surface of the cold plate coming together against the first surface of the vapor chamber upon insertion of the printed circuit board assembly into the bay, the complementary angles of the first surface of the vapor chamber and the first surface of the cold plate enabling a contact force between the first surfaces of the cold plate and vapor chamber upon insertion of the printed circuit board assembly into the bay and contact between the first surfaces of the cold plate and vapor chamber, the contact force promoting heat conduction.