US Patent No. 10,117,340

MANUFACTURING METHOD OF PACKAGE SUBSTRATE WITH METAL ON CONDUCTIVE PORTIONS


Patent No. 10,117,340
Issue Date October 30, 2018
Title Manufacturing Method Of Package Substrate With Metal On Conductive Portions
Inventorship Che-Wei Hsu, Hsinchu County (TW)
Shih-Ping Hsu, Hsinchu County (TW)
Pao-Hung Chou, Hsinchu County (TW)
Assignee Phoenix Pioneer technology Co., Ltd., Hsinchu County (TW)

Claim of US Patent No. 10,117,340

1. A manufacturing method of a package substrate, comprising:(a) forming a patterned first dielectric layer on a carrier, such that the first dielectric layer has a plurality of openings;
(b) forming a first wiring layer on a first surface of the first dielectric layer facing away from the carrier, a wall surface facing at least one of the openings, and the carrier in at least one of the openings;
(c) forming a first conductive pillar layer on a portion of the first wiring layer that is on the first surface;
(d) forming a second dielectric layer on the first surface, the first wiring layer, and the openings, wherein the first conductive pillar layer is exposed from the second dielectric layer;
(e) forming a second wiring layer on the exposed first conductive pillar layer and the second dielectric layer;
(f) forming an electrical pad layer on the second wiring layer; and
(g) forming a third dielectric layer on the second dielectric layer and the second wiring layer, wherein the electrical pad layer is exposed from the third dielectric layer.