US Patent No. 10,117,335

POWER MODULE


Patent No. 10,117,335
Issue Date October 30, 2018
Title Power Module
Inventorship Takuya Takahashi, Tokyo (JP)
Yasutaka Shimizu, Tokyo (JP)
Assignee Mitsubishi Electric Corporation, Tokyo (JP)

Claim of US Patent No. 10,117,335

1. A power module, comprising:a power semiconductor device; and
a chip component arranged on a first circuit pattern and a second circuit pattern that are electrically connected to said power semiconductor device, and arranged so as to bridge said first circuit pattern and said second circuit pattern, wherein:
said chip component is arranged so that a first electrode and a second electrode are respectively positioned on said first circuit pattern and said second circuit pattern, and said first electrode and said second electrode and said first circuit pattern and said second circuit pattern are respectively joined with solder layers;
between a lower surface of said chip component and said first circuit pattern and between the lower surface of said chip component and said second circuit pattern, two spacers are provided in parallel with each other respectively at positions close to said first electrode and said second electrode; and
said solder layers do not exist on an inner side of said two spacers in parallel with each other.