US Patent No. 10,117,329

CARRIER PLATE, DEVICE HAVING THE CARRIER PLATE AND METHOD FOR PRODUCING A CARRIER PLATE


Patent No. 10,117,329
Issue Date October 30, 2018
Title Carrier Plate, Device Having The Carrier Plate And Method For Producing A Carrier Plate
Inventorship Sebastian Brunner, Graz (AT)
Stefan Leopold Hatzl, Graz (AT)
Assignee QUALCOMM Incorporated, San Diego, CA (US)

Claim of US Patent No. 10,117,329

1. A carrier plate comprising:a substrate; and
a conductor track,
wherein the conductor track comprises a first layer arranged directly on the substrate,
wherein the conductor track further comprises a second layer arranged on the first layer,
wherein the second layer comprises gold,
wherein the second layer comprises a supply line region and a first soldering region at one end of the supply line region, the first soldering region defining an area forming a connection region for an electrical component,
wherein the second layer further comprises a second soldering region adjacent to another end of the supply line region opposite to the first soldering region,
wherein the second layer includes a first interrupted region so that the second layer is completely interrupted between the supply line region and the first soldering region,
wherein the second layer includes a second interrupted region between the supply line region and the second soldering region,
wherein the conductor track further comprises a third layer including nickel arranged between the first and second layers, and
wherein the conductor track further comprises a fourth layer arranged between the second and third layers.