US Patent No. 10,117,327

RADIO-FREQUENCY MODULE


Patent No. 10,117,327
Issue Date October 30, 2018
Title Radio-frequency Module
Inventorship Ryosuke Shiozaki, Tokyo (JP)
Maki Nakamura, Osaka (JP)
Junji Sato, Tokyo (JP)
Assignee Panasonic Intellectual Property Management Co., Ltd., Osaka (JP)

Claim of US Patent No. 10,117,327

1. A radio-frequency module comprising:a board;
an interconnect part having electrical conductivity provided on the board;
a land having electrical conductivity connected to the interconnect part;
a transmission circuitry connected to the land to transmit a signal;
a ground conductor formed at plane completely disposed surrounding a whole circumference of the land and the interconnect part;
an isolation part disposed between the land and the ground conductor to isolate the land and the ground conductor from each other, and disposed between the interconnect part and the ground conductor to isolate the interconnect part and the ground conductor from each other; and
a coupling part connected between the land and the ground conductor to short-circuit the land and the ground conductor.