US Patent No. 10,117,323


Patent No. 10,117,323
Issue Date October 30, 2018
Title Circuit Board With A Heat-conducting Element
Inventorship Thomas Wiesa, Vaihingen (DE)
Assignee Robert Bosch GmbH, Stuttgart (DE)

Claim of US Patent No. 10,117,323

1. A circuit carrier comprising at least one fiber-reinforced electrically insulating layer and at least one electrically conductive layer, wherein the circuit carrier includes at least one thermally conductive element, configured to conduct heat, that is embedded in a recess in the electrically insulating layer so as to be in contact with the electrically insulating layer, which element is configured to transport excess heat transversely to a planar extent of the circuit carrier, wherein the thermally conductive element includes at least two sub-elements that are each formed from a metal body and a connecting layer that is electrically insulating, wherein the connecting layer is positioned between the sub-elements and is configured to electrically insulate the sub-elements from one another and to connect the sub-elements to one another in a thermally conductive manner, wherein the thermally conductive element is a direct-bonded metal substrate, and wherein the sub-element is eutectically bonded to the connecting layer formed from ceramic.