US Patent No. 10,117,321

DEVICE INCLUDING A PRINTED CIRCUIT BOARD AND A METAL WORKPIECE


Patent No. 10,117,321
Issue Date October 30, 2018
Title Device Including A Printed Circuit Board And A Metal Workpiece
Inventorship Elvir Kahrimanovic, Villach (AT)
Assignee Infineon Technologies Austria AG, Villach (AT)

Claim of US Patent No. 10,117,321

1. A device, comprising:a first semiconductor package, comprising a semiconductor chip, an encapsulation material at least partly covering the semiconductor chip, and a contact element electrically coupled to the semiconductor chip and protruding out of the encapsulation material;
a printed circuit board, wherein the first semiconductor package is mounted on the printed circuit board and the contact element of the first semiconductor package is electrically coupled to the printed circuit board; and
a first metal workpiece mounted on the printed circuit board and adjacent to the first semiconductor package, wherein the first metal workpiece is electrically coupled to the contact element of the first semiconductor package and configured to provide a direct electrical connection between the contact element of the first semiconductor package and a second contact element of a second semiconductor package that is mounted on the printed circuit board, wherein the first semiconductor package is arranged over a first location on the printed circuit board and the second semiconductor package is arranged over a second location on the printed circuit board that is different than the first location.