US Patent No. 10,091,915

ELECTRONIC COMPONENT PACKAGE STRUCTURE AND ELECTRONIC DEVICE


Patent No. 10,091,915
Issue Date October 02, 2018
Title Electronic Component Package Structure And Electronic Device
Inventorship Xuequan Yu, Shanghai (CN)
Lin Yang, Shenzhen (CN)
Yadong Bai, Shenzhen (CN)
Assignee HUAWEI TECHNOLOGIES CO., LTD., Shenzhen (CN)

Claim of US Patent No. 10,091,915

1. An electronic component package structure, comprising:a substrate having a set attachment area for attaching an electronic component;
a conductive lid having a top and a sidewall that extend toward the substrate, one side of the sidewall being proximate to the substrate and having a bonding end, the bonding end bonding the conductive lid to the substrate using a non-conductive adhesive, the conductive lid bonded to the substrate enclosing the attachment area and forming a shielding space over the attachment area, the conductive lid bonded to the substrate enclosing the attachment area and forming a shielding space over the attachment area;
the non-conductive adhesive being located between the substrate and the bonding end; and
a solder mask disposed on a surface of one side of the substrate facing the conductive lid, the solder mask comprising a first open window disposed in a position in which the non-conductive adhesive is disposed.