US Patent No. 10,091,911

INTERFACE CARD COOLING USING HEAT PIPES


Patent No. 10,091,911
Issue Date October 02, 2018
Title Interface Card Cooling Using Heat Pipes
Inventorship Matthew J. Kelty, San Jose, CA (US)
Assignee Infinera Corporation, Sunnyvale, CA (US)

Claim of US Patent No. 10,091,911

1. A device comprising:a frame section having a cage with a first receiving portion and a second receiving portion,
the second receiving portion receiving a module;
a first plate having an end,
the first plate being received by the first receiving portion to attach the first plate to the frame section, the first plate having a groove;
a heat pipe having a first end and having a second end;
a second plate attached to the second end of the heat pipe;
a cover attaching the first plate, the heat pipe, and the second plate to the frame section; and
a spring attached to the first plate and disposed between the first plate and the cover to bias the first plate against the module, the groove exposing part of the heat pipe including the first end, said exposed part of the heat pipe extending in a direction toward the second end of the heat pipe and contacting the spring, the groove having a closed portion adjacent the first end of the heat pipe and an open portion at a location spaced from the first end, such that the heat pipe extends through the open portion in the direction toward the second end, a portion of the heat pipe extending from the open portion to the second end being provided in the groove,
the first plate being capable of receiving heat dissipated by the module,
the heat pipe being capable of receiving the heat received by the first plate and transferring the heat to the second plate,
the second plate being capable of receiving the heat transferred by the heat pipe and dissipating the received heat.