US Patent No. 10,091,908

HEAT DISSIPATION DEVICE AND METHOD OF DISSIPATING HEAT


Patent No. 10,091,908
Issue Date October 02, 2018
Title Heat Dissipation Device And Method Of Dissipating Heat
Inventorship Osamu Saito, Kawasaki (JP)
Takaharu Izuno, Kawasaki (JP)
Minoru Fujii, Kawasaki (JP)
Kenji Joko, Yokohama (JP)
Mitsuaki Hayashi, Kawasaki (JP)
Hideaki Matsumoto, Yokohama (JP)
Katsumi Kanasaki, Machida (JP)
Assignee FUJITSU LIMITED, Kawasaki (JP)

Claim of US Patent No. 10,091,908

1. A heat dissipation device comprising:a heat sink mounted on a substrate;
a first opening and a second opening that penetrate the heat sink arranged in parallel direction to the substrate, the first opening is arranged at a first distance from the substrate and the second opening is arranged at the first distance from the substrate;
a first heat receiving member disposed on a first electronic component mounted on the substrate;
a second heat receiving member disposed on a second electronic component mounted on the substrate; and
a first heat pipe and a second heat pipe, one end side of the first heat pipe is fixed to the first heat receiving member and other end side of the first heat pipe is inserted in the first opening and fixed at a first position, one end side of the second heat pipe is fixed to the second heat receiving member and other end side of the second heat pipe is inserted in the second opening and fixed at a second position,
wherein an inner diameter of the first and second openings in a perpendicular direction to a surface of the substrate is larger than a diameter of the first and second heat pipes in the perpendicular direction to the surface of the substrate, and
wherein a height of the second electronic component is higher than a height of the first electronic component, and the second position from the substrate is located higher than the first position.