US Patent No. 10,091,892

LASER DIRECT IMAGING SYSTEM AND METHOD FOR SOLDER MASK EXPOSURE


Patent No. 10,091,892
Issue Date October 02, 2018
Title Laser Direct Imaging System And Method For Solder Mask Exposure
Inventorship Chun-Chih Chuang, Taichung (TW)
Yung-Peng Hu, Taichung (TW)
Assignee SHUZ TUNG MACHINERY INDUSTRIAL CO., LTD., Taichung (TW)

Claim of US Patent No. 10,091,892

1. A laser direct imaging system, comprising:a stage being subjected to an atmospheric environment;
a laser device configured to provide at least one laser beam to a surface of a solder mask-coated substrate located on the stage; and
an oxygen-reducing device, which during operation of the laser device continuously outputs an inert gas to a specific area of the surface of the solder mask-coated substrate where the laser beam is being aimed, and a peripheral area around the specific area such that the laser beam generated by the laser device is surrounded by the outputted inert gas, thereby separating the specific area of the surface of the solder mask-coated substrate from the atmospheric environment;
wherein the oxygen-reducing device includes a gas supply system for supplying the inert gas; and a chamber having an inlet connected to the gas supply system for entrance of the inert gas into the chamber, and an outlet facing the solder mask-coated substrate to allow the inert gas to flow across the surface of the solder mask-coated substrate;
wherein the laser beam generated by the laser device passes through the outlet of the chamber to the surface of the solder mask-coated, and the laser beam passing out of the outlet of the chamber is surrounded by the inert gas; and
wherein the laser device comprises a plurality of laser diodes arranged in a line to produce two or more laser beams; and the oxygen-reducing device further includes a flow guiding plate disposed in the outlet of the chamber, wherein the flow guiding plate defines a plurality of holes corresponding to the laser diodes in such a way that the laser beam emitted by each of the laser diodes is passed through the respective hole of the flow guiding plate to the solder mask-coated substrate.