US Patent No. 10,091,887

MULTI-MATERIAL STRUCTURE WITH EMBEDDED ELECTRONICS


Patent No. 10,091,887
Issue Date October 02, 2018
Title Multi-material Structure With Embedded Electronics
Inventorship Mikko Heikkinen, Oulu (FI)
Jarmo Saaski, Kempele (FI)
Assignee TACTOTEK OY, Oulunsalo (FI)

Claim of US Patent No. 10,091,887

1. A multilayer structure for an electronic device, comprising:a flexible substrate film for accommodating electronics, the flexible substrate film having a first surface area and an adjacent second surface area;
a number of electronic components provided on the first surface area of the flexible substrate film;
a number of conductive traces printed on the flexible substrate film for electrically connecting the electronic components together;
a first thermoplastic material overmolded to the number of electronic components and the related first surface area of the flexible substrate film accommodating the electronic components; and
a second thermoplastic material overmolding the adjacent second surface area and at least part of the first surface area so that at least part of the electronic components and the first thermoplastic material thereon are substantially embedded between the flexible substrate film and the second thermoplastic material,
wherein the first thermoplastic material exhibits a first elasticity and the second thermoplastic material exhibits a second, different elasticity, and
wherein the first thermoplastic material is configured to prevent the first surface area of the flexible substrate from deformation and the second thermoplastic material is configured to allow the flexible substrate to be bendable.