US Patent No. 10,091,886

COMPONENT BUILT-IN MULTILAYER BOARD


Patent No. 10,091,886
Issue Date October 02, 2018
Title Component Built-in Multilayer Board
Inventorship Kosuke Nishino, Nagaokakyo (JP)
Kuniaki Yosui, Nagaokakyo (JP)
Assignee MURATA MANUFACTURING CO., LTD., Kyoto (JP)

Claim of US Patent No. 10,091,886

1. A component built-in multilayer board comprisinga multilayer substrate including a plurality of laminated base material layers; and
a component built in the multilayer substrate; wherein
at least one of the base material layers is made of a thermoplastic resin;
at least one of the base material layers includes a bottom portion that is flush with the component and a top surface that is above the component;
in the multilayer substrate, a number of the laminated base material layers in a portion overlapping the component as seen from a lamination direction is equal to a number of the laminated base material layers in a portion around the component as seen from the lamination direction;
a thickness adjustment member that adjusts a thickness of the multilayer substrate is provided on a principal surface of at least one of the base material layers and around the component as seen from the lamination direction, so as to surround the component;
the multilayer substrate does not include an opening for housing the component; and
both principal surfaces of the multilayer substrate are flat or substantially flat.