US Patent No. 10,091,883

DIELECTRIC FILMLESS ELECTRONIC MODULE AND METHOD FOR MANUFACTURING SAME


Patent No. 10,091,883
Issue Date October 02, 2018
Title Dielectric Filmless Electronic Module And Method For Manufacturing Same
Inventorship Lucile Dossetto, La Ciotat (FR)
Line Degeilh, La Ciotat (FR)
Assignee GEMALTO SA, Meudon (FR)

Claim of US Patent No. 10,091,883

1. An electronic module comprising a first conductive layer or sheet including at least one conductive surface, an electrically insulating layer consisting of a single layer of an adhesive connected to the first conductive layer or sheet via direct contact with a first surface of the single layer of adhesive, a second conductive layer or sheet connected to the single layer of adhesive via direct contact with the opposite surface thereof, and a chip or electronic chip disposed on the second conductive layer or sheet and electrically connected to said at least one conductive surface, through the electrically insulating layer,wherein the second conductive layer or sheet is made of metal and comprises holes or connection openings for electrically connecting the chip to said at least one conductive surface.