US Patent No. 10,091,873

PRINTED CIRCUIT BOARD AND INTEGRATED CIRCUIT PACKAGE


Patent No. 10,091,873
Issue Date October 02, 2018
Title Printed Circuit Board And Integrated Circuit Package
Inventorship Yongming Xiong, Fremont, CA (US)
Assignee Innovium, Inc., San Jose, CA (US)

Claim of US Patent No. 10,091,873

1. An apparatus comprising:a printed circuit board that includes:
a multilayer lamination of one or more ground layers, one or more power layers, and a plurality of signal layers;
a plurality of vias that are located on a first surface of the printed circuit board; and
a plurality of bonding pads that couple a ball grid array of an integrated circuit package to the one or more ground layers, the one or more power layers, and the plurality of signal layers through the plurality of vias, wherein the plurality of bonding pads includes:
first bonding pads that are arranged in a first area of the printed circuit board and that are configured to transfer multiple pairs of first differential signals between the printed circuit board and the integrated circuit package, each of the first bonding pads being coupled to a via of the plurality of vias in the first area,
second bonding pads that are arranged in a second area of the printed circuit board and that are configured to transfer multiple pairs of second differential signals between the printed circuit board and the integrated circuit package, each of the second bonding pads being coupled to a via of the plurality of vias in the second area, and
third bonding pads that are arranged in a third area of the printed circuit board and that couple the integrated circuit package to ground of the printed circuit board, each of the third bonding pads being coupled to two or more vias of the plurality of vias in the third area,
wherein the third area is located between the first area and the second area.