US Patent No. 10,076,037

PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE, AND MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD


Patent No. 10,076,037
Issue Date September 11, 2018
Title Printed Circuit Board, Electronic Device, And Manufacturing Method Of Printed Circuit Board
Inventorship Kunihiko Minegishi, Yokohama (JP)
Assignee CANON KABUSHIKI KAISHA, Tokyo (JP)

Claim of US Patent No. 10,076,037

1. A printed circuit board comprising:an electronic component having a side face and a face on which a plurality of first lands are arranged;
a printed wiring board having a face on which a plurality of second lands corresponding to the plurality of the first lands are arranged;
a plurality of pieces of first solder each of which electrically connects each of the plurality of the first lands to corresponding one of the plurality of the second lands;
second solder arranged outside of an outermost one of the plurality of pieces of the first solder; and
a thermosetting resin that covers at least a part of the second solder and adheres the side face of the electric component and the printed wiring board.