US Patent No. 10,071,902

METHOD FOR ASSEMBLING CONDUCTIVE PARTICLES INTO CONDUCTIVE PATHWAYS AND SENSORS THUS FORMED


Patent No. 10,071,902
Issue Date September 11, 2018
Title Method For Assembling Conductive Particles Into Conductive Pathways And Sensors Thus Formed
Inventorship Mark Buchanan, Oslo (NO)
Matti Knaapila, Drammen (NO)
Geir Helgesen, Finstadjordet (NO)
Henrik Hoeyer, Skien (NO)
Assignee CONDALIGN AS, Kjeller (NO)

Claim of US Patent No. 10,071,902

1. A method for forming a sensor on a substrate, the method comprising, in the following order:a. forming a layer of a mixture comprising a matrix and conductive particles on a substrate, the mixture having a first viscosity which allows the conductive particles to rearrange within the layer;
b. applying an electric field over the layer with electrodes, so that a number of the conductive particles are assembled and aligned with the electric field, thus creating one or more anisotropic conductive pathways in the layer, wherein at least one of the electrodes that applies the electric field to assemble and align the conductive particles is not in direct contact with the layer while the electric field is applied;
c. changing the viscosity of the layer to a second viscosity, said second viscosity being higher than the first viscosity, in order to mechanically stabilize the layer and preserve the one or more anisotropic conductive pathways.