1. A method for manufacturing an electronic device in a production line, comprising the steps of:electrically coupling and physically securing at least one surface mount device (SMD) on a printed circuit board (PCB) to form an electronic subassembly at a surface mount technology (SMT) station in the production line;
applying a moisture-resistant protective coating to at least one portion of the electronic subassembly at a coating station in the production line;
applying a second moisture-resistant protective coating, to a different portion of the electronic subassembly than the at least one portion, at a second coating station in the production line; and
assembling electronic parts, user interface components, and housing components with the electronic subassembly at an assembly station in the production line.