US Patent No. 10,070,569

METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE


Patent No. 10,070,569
Issue Date September 04, 2018
Title Method For Manufacturing An Electronic Device
Inventorship Blake L. Stevens, Morristown, NJ (US)
Max E. Sorenson, Herriman, UT (US)
Marc K. Chason, Schaumburg, IL (US)
Assignee HZO, Inc., Draper, UT (US)

Claim of US Patent No. 10,070,569

1. A method for manufacturing an electronic device in a production line, comprising the steps of:electrically coupling and physically securing at least one surface mount device (SMD) on a printed circuit board (PCB) to form an electronic subassembly at a surface mount technology (SMT) station in the production line;
applying a moisture-resistant protective coating to at least one portion of the electronic subassembly at a coating station in the production line;
applying a second moisture-resistant protective coating, to a different portion of the electronic subassembly than the at least one portion, at a second coating station in the production line; and
assembling electronic parts, user interface components, and housing components with the electronic subassembly at an assembly station in the production line.