US Patent No. 10,070,562


Patent No. 10,070,562
Issue Date September 04, 2018
Title Method And Apparatus For Heat-dissipation In An Avionics Chassis
Inventorship Stefano Angelo Mario Lassini, Lowell, MI (US)
Stephen Nils Holen, Rockford, MI (US)
Michael James Dusseau, Walker, MI (US)
Assignee GE Aviation Systems LLC, Grand Rapids, MI (US)

Claim of US Patent No. 10,070,562

1. An avionics chassis assembly, comprising: a housing having an outer surface, defining an exterior of the housing, an inner surface, defining an interior of the housing, and a set of walls at least partially separating the exterior of the housing from the interior of the housing; a heat generating component located within the interior of the housing; a thermal plane thermally coupled to the heat generating component and configured to direct heat away from the heat generating component; and an electronic circuit board wherein the heat generating component is mounted to the electronic circuit board, wherein an opening is included in the housing and the opening is configured to receive at least a portion of the thermal plane such that the at least a portion of the thermal plane passes through the opening and is located exteriorly of the housing to define an extending thermal plane portion, wherein the thermal plane overlies the electronic circuit board, and wherein the extending thermal plane portion comprises electromagnetic interference seals to ensure environmental compatibility with the interior of the housing; and wherein the housing comprises a selectively removable front cover, wherein the opening is located within the front cover, and wherein the opening comprises a laterally-extending slot.